Telco tower operator Dayamitra Telekomunikasi (MTEL) or Mitratel plans to issue bonds worth Rp2.5 trillion and sukuk (Islamic bonds) worth Rp500 billion. It will issue phase I of sustainable bonds in 2024 with a maximum principal amount of Rp240.22 billion, having an interest rate of 6.5% with a term of 370 calendar days. MTEL said all funds obtained from bond and sukuk offering will be used to repay part of the principal loan to Bank Mandiri (BMRI).To subscribe please click here
