Tower Bersama Infrastructure plans to issue bonds worth Rp700 billion, part of its Rp5 trillion bond issue program. The bonds will have tenor of 3 years and offer annual coupon rates at 8.40%. The offering is scheduled for September 11-13, 2017. Acting as underwriters are CIMB Sekuritas Indonesia, DBS Vickers Sekuritas Indonesia, and Indo Premier Sekuritas. The bond proceeds will be used to pay debt of unit, SKP.