Telco tower operator Tower Bersama Infrastructure (TBIG) plans to issue bonds worth Rp700 billion, part of its Rp7 trillion bond issue program. The bonds will be issue in 2 series with tenor of 3 years and 5 years. The book building starts today and will last in June 7, 2018. The offering is set for June 29 and July 2. Acting as underwriters are CGS-CIMB Sekuritas Indonesia, DBS Vickers Sekuritas Indonesia, and Indo Premier Sekuritas. The bond proceeds will be used to pay debt of subsidiaries; PT Solusi Menara Indonesia (SMI) and PT Solu Sindo Kreasi Pratama (SKP). Both subsidiaries have revolving loan worth US$1 billion to creditors, to pay through United Overseas Bank Ltd.