TELKOM — PT Telekomunikasi Indonesia (Telkom) Tbk (TLKM) plans to issue bonds worth Rp7 trillion, part of its Rp12 trillion bond issue program. The offering is scheduled for today and tomorrow (June 17-18). The bonds will be issued in 4 series with tenor of 7 years, 10 years, 15 years, and 30 years. The bond coupon is set at 9.925% per annum for series A bonds amounting Rp2.2 trillion, 10.250% for series B Rp2.1 trillion, 10.6% for series C Rp1.2 trillion, and 11% for series D bond amounting Rp1.5 trillion. Acting as underwriters are PT Bahana Securities, PT Danareksa Sekuritas, PT Mandiri Sekuritas, and PT Trimegah Securities.To subscribe please click here